• Yamatake's R&D
• R&D Projects

Microprocessing

	High-speed cutting of silicon wafers
	High-speed microdrilling of stainless steel
	Pressure-resistant glass seals with superior insulation properties

High-speed cutting of silicon wafers

Perforated silicon wafer

Conventionally, silicon is processed using ultrasonic machining techniques, but Yamatake has developed a high-speed cutting technology that uses diamond-electrocoated drills. This not only greatly reduces processing time but also ensures consistent quality.

High-speed microdrilling of stainless steel

As a result of ongoing R&D work aimed at achieving faster microdrilling of stainless steel, a technology that will help to cut the cost of sensor devices, we have succeeded in drilling 0.6mm diameter perforations with an aspect (L/D) ratio of approximately 10.

Pressure-resistant glass seals with superior insulation properties

Yamatake is actively pursuing research into a glass hermetic seal production technology using high-quality compression shields that have no bubbles (voids) inside the glass. This will enable the manufacture of high-quality pressure sensors.
Additionally, in order to enhance the packing density and performance of sensor devices, we are engaged in R&D projects involving the diffusion bonding of ultra-thin diaphragms and high-temperature, high-pressure glass bonding.


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