Yamatake Corporation

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Press Release

Yamatake Corporation Increases Investment in Ball Semiconductor, Speeds Up Development of Wireless Temperature Sensors

Tokyo, Japan, April 17, 2001 - Yamatake Corporation (Tokyo, Japan) has signed new agreements to strengthen joint R&D activities with Ball Semiconductor Inc. (Allen, TX, USA), a company that specializes in the development of spherical semiconductors. These agreements will provide additional investment in the two companies' ongoing joint R&D project to develop commercial applications for spherical semiconductors. Yamatake sees this technology as the key to next-generation sensors, and is currently developing with Ball Semiconductor its first product to employ this technology - namely, a wireless temperature sensor.

Yamatake and Ball Semiconductor made their first agreement to jointly develop a wireless temperature sensor in December 1999. By the end of 2000, they succeeded in etching a temperature sensing circuit, power circuit, and transmission circuit on the surface of a spherical semiconductor with 1mm diameter.

To accelerate the development of potential applications for spherical semiconductors, Yamatake has sent four engineers to Ball Semiconductor's headquarters for 18 months starting April 2001. There, they will work closely with two Ball Semiconductor engineers in developing next-generation sensors and manufacturing equipment. Under the new agreements with Ball Semiconductor, Yamatake will invest approximately US$1.6 million (¥200 million) in the joint development of manufacturing equipment, and retain ownership of all related intellectual property. Yamatake has also invested an additional US$1 million in Ball Semiconductor, bringing its total investment to approximately US$1.8 million.

Yamatake expects the development of the wireless temperature sensor to lead to significant growth in highly promising markets for wearable or embedded applications, made possible by low-cost and wireless sensing capabilities. The two companies are actively working together to be the pioneers in advanced sensing technologies.

About spherical semiconductors

With this revolutionary concept in next-generation semiconductor technology, integrated circuits and MEMS(Micro Electro Mechanical Systems) are etched not on flat wafers but on the curved surface of silicon spheres. The manufacturing process required for these silicon balls is much simpler than that employed for conventional wafer-based semiconductors. Thus, one benefit is that the investment required for building a plant to mass-produce ball semiconductors will be just one-tenth of that currently needed. This will enable new enterprises to participate in the semiconductor and sensor markets, which have till now demanded investments on a scale that only the largest companies could afford. As a result, new growth will come to these industries. Also, with the cost of manufacturing ICs to fall dramatically, these miniature ball semiconductors (diameter: 1mm) are sure to find many new applications - previously undreamt of - in new fields and in large quantities. This spherical sensor technology is attracting a great deal of interest.

About wireless temperature sensors

A temperature sensing circuit, control logic circuit, wireless transmission circuit, and coil are etched on the surface of a spherical semiconductor (diameter: 1mm). The sensor gathers temperature data that is transmitted to an external transceiver unit, which also powers the sensor remotely using radio waves that are picked up by the coil. The measurement range is -55°C to +125°C with a precision of ±0.01°C.

Potential applications for this wireless temperature sensor are numerous. Thanks to its small size, low cost, wireless capability, high accuracy and wearability, it can contribute to energy conservation, environmental protection, and enhanced safety in the automation field in which Yamatake specializes. Since the sensor can be set in close proximity to its target, it will greatly enhance the accuracy of readings, thus facilitating optimized temperature control. By employing wireless technology, both its wiring and cost of installation are reduced.

Building on the expertise gained in developing this wireless temperature sensor, Yamatake will also develop sensors for humidity, pressure and flow using the same spherical semiconductor technology. Besides revolutionizing the sensing technologies currently employed in the fields of building automation, industrial systems and control products, these sensors will lead to business expansion in new markets for Yamatake.



Company Profile

Company :Ball Semiconductor Inc.
Chairman & President :Akira Ishikawa
Head Office :Allen (outside Dallas), TX, USA
Established :October, 1996
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